High efficiency Cu2ZnSn(S,Se)4 solar cells by applying a double in 2S3/CdS Emitter
- Jeehwan Kim
- Homare Hiroi
- et al.
- 2014
- Advanced Materials
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79 results for Marinus Hopstaken
Ultra low contact resistivities for CMOS beyond 10-nm node
- Zhen Zhang
- Siyuranga Obasa Koswatta
- et al.
- 2013
- IEEE Electron Device Letters
Sharp reduction of contact resistivities by effective schottky barrier lowering with silicides as diffusion sources
- Zhen Zhang
- F. Pagette
- et al.
- 2010
- IEEE Electron Device Letters
CMOS compatible high performance IIIV devices: Opportunities and challenges
- Yanning Sun
- Kuen-Ting Shiu
- et al.
- 2016
- ECS Meeting 2016
Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
Study of surface interactions for encapsulation of phase change memory materials
- L. Buzi
- D. Koty
- et al.
- 2022
- SPIE Advanced Lithography 2022
Process-Induced ReRAM Performance Improvement of Atomic Layer Deposited HfO2 for Analog In-Memory Computing Applications
- Steven Consiglio
- H. Higuchi
- et al.
- 2021
- IMCS 2021
Effect of surface temperature on GeSbTe damage formation during plasma processing
- L. Buzi
- J. M. Papalia
- et al.
- 2021
- SPIE Advanced Lithography 2021
Low-temperature growth of strained germanium quantum wells for high mobility applications
- Stephen W. Bedell
- S. Hart
- et al.
- 2020
- PRiME 2020
Si Incorporation Into AsSeGe Chalcogenides for High Thermal Stability, High Endurance and Extremely Low Vth Drift 3D Stackable Cross-point Memory
- Huai-Yu Cheng
- I. Kuo
- et al.
- 2020
- VLSI Technology 2020