Speeding up OPC by leveraging existing designs with machine learning
- Cheng Chi
- Julian Dolby
- et al.
- 2021
- SPIE Advanced Lithography 2021
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11 results for Cheng Chi
LCDU improvement of EUV-patterned vias with DSA
- Jing Guo
- Dustin W. Janes
- et al.
- 2019
- MEMS/NEMS/MOEMS 2019
The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
- Chi-Chun Liu
- Yann Mignot
- et al.
- 2018
- SPIE Advanced Lithography 2018
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
Advanced fast 3D DSA model development and calibration for design technology co-optimization
- Kafai Lai
- Balint Meliorisz
- et al.
- 2017
- SPIE Advanced Lithography 2017
Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- SPIE Advanced Lithography 2017
DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
Strategies to enable directed self-Assembly contact hole shrink for tight pitches
- Kristin Schmidt
- Hitoshi Osaki
- et al.
- 2016
- SPIE Advanced Lithography 2016
Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- J. Micro/Nanolithogr. MEMS MOEMS