Electromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR
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38 results for M.W. Lane
Effects of amine- and pyridine-terminated molecular nanolayers on adhesion at Cu-SiO 2 interfaces
- P.G. Ganesan
- G. Cui
- et al.
- 2005
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Environmental effects on cracking and delamination of dielectric films
- Michael W. Lane
- Xia Hu Liu
- et al.
- 2004
- IEEE T-DMR
Liner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
- G. Ramanath
- G. Cui
- et al.
- 2003
- Applied Physics Letters
Relationship between interfacial adhesion and electromigration in Cu metallization
- M.W. Lane
- E. Liniger
- et al.
- 2003
- Journal of Applied Physics
Invited paper environmental effects on interfacial adhesion
- M.W. Lane
- J.M. Snodgrass
- et al.
- 2001
- Microelectronics Reliability
Plasticity contributions to interface adhesion in thin-film interconnect structures
- Michael Lane
- Reinhold H. Dauskardt
- et al.
- 2000
- Journal of Materials Research