Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
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38 results for M.W. Lane
Liner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
- G. Ramanath
- G. Cui
- et al.
- 2003
- Applied Physics Letters
Interfacial relationships in microelectronic devices
- Michael Lane
- Robert Rosenberg
- 2003
- MRS Proceedings 2003
Relationship between interfacial adhesion and electromigration in Cu metallization
- M.W. Lane
- E. Liniger
- et al.
- 2003
- Journal of Applied Physics
Relationship between interfacial adhesion and electromigration in Cu metallization
- J.R. Lloyd
- M.W. Lane
- et al.
- 2002
- IIRW 2002
Invited paper environmental effects on interfacial adhesion
- M.W. Lane
- J.M. Snodgrass
- et al.
- 2001
- Microelectronics Reliability
Plasticity contributions to interface adhesion in thin-film interconnect structures
- Michael Lane
- Reinhold H. Dauskardt
- et al.
- 2000
- Journal of Materials Research