Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- Evan G. Colgan
- Kai Schleupen
- et al.
- 2023
- IEEE Transactions on CPMT
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14 results for Steven A. Cordes
Development of electroless nickel-iron plating process for microelectronic applications
- Yu Luo
- Sung K. Kang
- et al.
- 2014
- ECTC 2014
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2005
- CICC 2005
High mobility p-channel germanium MOSFETS with a thin Ge oxynitride gate dielectric
- Huiling Shang
- Harald Okorn-Schmidt
- et al.
- 2002
- IEDM 2002
Electron and hole mobility enhancement in strained SOI by wafer bonding
- Lijuan Huang
- Jack O. Chu
- et al.
- 2002
- IEEE Transactions on Electron Devices
Enhanced thermoelectric cooling at cold junction interfaces
- Uttam Ghoshal
- S. Ghoshal
- et al.
- 2002
- Applied Physics Letters
Carrier mobility enhancement in strained Si-On-Insulator fabricated by wafer bonding
- L.J. Huang
- J.O. Chu
- et al.
- 2001
- VLSI Technology 2001
Lithographically fabricated fiber guides for optical subassemblies
- M.S. Cohen
- Mike Cordes
- et al.
- 2001
- ECTC 2001
Mask technology for excimer laser projection ablation
- J.L. Speidell
- S. Cordes
- et al.
- 1997
- BACUS Symposium on Photomask Technology and Management 1997
A novel aluminum on quartz mask for excimer laser projection ablation
- R.S. Patel
- J.L. Speidell
- et al.
- 1997
- International Journal of Microcircuits and Electronic Packaging