Electromigration path in Cu thin-film lines
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- Applied Physics Letters
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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149 results for C. K. Hu
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
- P.-C. Wang
- G.S. Cargill
- et al.
- 1998
- Applied Physics Letters
Copper interconnections and reliability
- C.-K. Hu
- J.M.E. Harper
- 1998
- Materials Chemistry and Physics
Electromigration in 0.25 μm wide Cu line on W
- C.-K. Hu
- K.Y. Lee
- et al.
- 1997
- Thin Solid Films
Electromigration failures in line-stud structures as a function of line length
- M.B. Small
- C.-K. Hu
- 1997
- Thin Solid Films
Grain boundary diffusion and electromigration in Cu-Sn alloy thin films and their VLSI interconnects
- D. Gupta
- C.-K. Hu
- et al.
- 1997
- Defect and Diffusion Forum
Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers
- A. Domenicucci
- R. Filippi
- et al.
- 1996
- Journal of Applied Physics
Electromigration drift velocity in Al-alloy and Cu-alloy lines
- C.-K. Hu
- K.Y. Lee
- et al.
- 1996
- JES
In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects
- K.-L. Lee
- C.-K. Hu
- et al.
- 1995
- Journal of Applied Physics