Lithography and fabrication processes for sub-100 nm scale complementary metal-oxide semiconductor
- S.J. Wind
- Y. Taur
- et al.
- 1995
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
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149 results for C. K. Hu
Copper interconnection integration and reliability
- C.-K. Hu
- B. Luther
- et al.
- 1995
- Thin Solid Films
Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnections
- C.-K. Hu
- 1995
- Thin Solid Films
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
- C.-K. Hu
- K.P. Rodbell
- et al.
- 1995
- IBM J. Res. Dev
Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures
- I.-S. Yeo
- S.G.H. Anderson
- et al.
- 1995
- Journal of Applied Physics
The microstructural stability of Al(Cu) lines during electromigration
- T.M. Shaw
- C.-K. Hu
- et al.
- 1995
- Applied Physics Letters
Electromigration in two-level interconnects of Cu and Al alloys
- C.-K. Hu
- B. Luther
- 1995
- Materials Chemistry & Physics
Electromigration failure due to interfacial diffusion in fine Al alloy lines
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Applied Physics Letters
Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Journal of Applied Physics
Octagonal Washer De Squids and Integrated Susceptometers Fabricated in a Planarized Sub-^Im Nb - A10X - Nb Technology
- M.B. Ketchen
- D.J. Pearson
- et al.
- 1993
- IEEE TAS