Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- Luciana Meli
- Indira Seshadri
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Publications
4 results for Yasiel Cabrera
Evaluating Novel Material Stacks Towards Gate Width Roughness Reduction
- Gopal Kenath
- Martin Burkhardt
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Dry Resist Characterization Towards Technology Insertion for 28-36P EUV Patterning
- Yasiel Cabrera
- Gopal Kenath
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Scaling opportunities for Gate-All-Around and beyond: A patterning perspective
- Indira Seshadri
- Eric Miller
- et al.
- 2023
- IEDM 2023