Ernest Y Wu, Takashi Ando, et al.
IEDM 2023
Invited talk
Scaling opportunities for Gate-All-Around and beyond: A patterning perspective
Abstract
Here, we review how EUV (extreme ultraviolet) lithography especially in the front end of line simplifies gate all around fabrication. We discuss avenues to the further scaling of GAA - High Numerical Aperture (NA=0.55) EUV and chiplet integration.
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