Use of difunctional silylation agents for enhanced repair of post plasma damaged porous low k dielectrics
- S.V. Nitta
- S. Purushothaman
- et al.
- 2005
- AMC 2005
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62 results for S. Purushothaman
BEOL interconnects for 45 nm node and beyond
- R.R. Yu
- J. Doyle
- et al.
- 2005
- VMIC 2005
Looking into the crystal ball: Future device learning using hybrid E-beam and optical lithography
- S.E. Steen
- S.J. McNab
- et al.
- 2005
- Microlithography 2005
Analysis of an extreme low-κ organosilicate dielectric film exposed to representative plasmas and to a restorative process
- M. Colburn
- S.V. Nitta
- et al.
- 2003
- AMC 2003
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
DUV stability of carbon films for attenuated phase shift mask applications
- Alessandro Callegari
- Katherina Babich
- et al.
- 1998
- SPIE Advanced Lithography 1998
New high conductivity lead (Pb)-free conducting adhesives
- S.K. Kang
- T. Graham
- et al.
- 1995
- IEEE International Symposium on Electronics and the Environment 1995
Thin film transfer process for low cost mcm-d fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1994
- MCMC 1994
Thin film transfer process for low cost MCM's
- C. Narayan
- S. Purushothaman
- 1993
- IEMT 1993
Ta/polyimide adhesion durability
- A.C. Callegari
- B.K. Furman
- et al.
- 1992
- ESSDERC 1992