Chip-level power-performance optimization through thermally-driven across-chip variation (ACV) reduction
- X. Yu
- Oleg Gluschenkov
- et al.
- 2011
- IEDM 2011
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19 results for A.C. Mocuta
Technology elements of a common platform bulk foundry offering (invited)
- P. Gilbert
- A. Steegen
- et al.
- 2007
- IEDM 2007
Performance comparison and channel length scaling of strained Si FETs on SiGe-on-insulator (SGOI)
- J. Cai
- K. Rim
- et al.
- 2004
- IEDM 2004
Performance enhancement on sub-70 nm strained silicon SOI MOSFETS on ultra-thin thermally mixed strained silicon/SiGe on insulator(TM-SGOI) substrate with raised S/D
- B.H. Lee
- A.C. Mocuta
- et al.
- 2002
- IEDM 2002
Low field mobility characteristics of sub-100 nm unstrained and strained Si MOSFETs
- K. Rim
- S. Narasimha
- et al.
- 2002
- IEDM 2002
Extreme scaling with ultra-thin Si channel MOSFETs
- Bruce Doris
- Meikei Ieong
- et al.
- 2002
- IEDM 2002
Controlling floating-body effects for 0.13μm and 0.10μm SOI CMOS
- S.K.H. Fung
- N. Zamdmer
- et al.
- 2000
- IEDM 2000
80 nm poly-silicon gated n-FETs with ultra-thin Al2O3 gate dielectric for ULSI applications
- D.A. Buchanan
- E. Gusev
- et al.
- 2000
- IEDM 2000
Reverse temperature dependence of circuit performance in high- k/metal-gate technology
- Shu-Jen Han
- Dechao Guo
- et al.
- 2009
- IEEE Electron Device Letters
Reduction of RTA-driven intra-die variation via model-based layout optimization
- J.C. Scott
- O. Gluschenkov
- et al.
- 2009
- VLSI Technology 2009