Device, Circuit, and Technology Scaling to Micron and Submicron Dimensions
- Arnold Reisman
- 1983
- Proceedings of the IEEE
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39 results for Arnold Reisman
Heat dissipation from silicon chips in a vertical plate, elevated pressure cold wall system
- A. Reisman
- M. Berkenblit
- et al.
- 1982
- Journal of Electronic Materials
The formation of ß SiC on Si
- M. Balog
- A. Reisman
- et al.
- 1980
- Journal of Electronic Materials
1 µm MOSFET VLSI Technology: Part 1-An Overview
- Hwa-Nien Yu
- Arnold Reisman
- et al.
- 1979
- IEEE T-ED
The use of differential thermal analysis for the examination of glasses
- A. Reisman
- M. Berkenblit
- et al.
- 1975
- Journal of Electronic Materials
Thermal forming of niobium oxide switchable resistors
- K.C. Park
- M. Berkenblit
- et al.
- 1973
- Journal of Electronic Materials
The epitaxial growth of ZnO on sapphire and MgAl spinel using the vapor phase reaction of Zn and H2O
- A. Reisman
- M. Berkenblit
- et al.
- 1973
- Journal of Electronic Materials
The equilibrium constant for the reaction of ZnO + H2 and the chemical vapor transport of zno via the Zn + H2O reaction
- A. Reisman
- M. Berkenblit
- et al.
- 1972
- Journal of Electronic Materials
Small area deposition of Ge on Ge or GaAs substrates via the disproportionation of GeI2
- M. Berkenblit
- A. Reisman
- 1971
- Metallurgical Transactions
The Chemical Polishing of Sapphire and MgAI Spinel
- A. Reisman
- M. Berkenblit
- et al.
- 1971
- JES