Stress behavior during thermal cycling in metal-polyimide layered films
- M.A. Moske
- J.E. Lewis
- et al.
- 1991
- ANTEC Annual Technical Conference 1991
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22 results for J.E. Lewis
PROCESSING CONCERNS FOR MULTI-LEVEL THIN FILM METALLIZATION.
- C. Narayan
- J.E. Lewis
- et al.
- 1986
- ECS Meeting 1986
DIFFUSION BARRIER STUDIES FOR Cu.
- C.-K. Hu
- S. Chang
- et al.
- 1985
- VMIC 1985
Contact reactions in Pd/GaAs junctions
- J.O. Olowolafe
- P.S. Ho
- et al.
- 2008
- Journal of Applied Physics
Grain boundary diffusion of aluminum in polycrystalline silicon films
- J.C.M. Hwang
- P.S. Ho
- et al.
- 2008
- Journal of Applied Physics
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Silicon dioxide defects induced by metal impurities
- H. Dallaporta
- M. Liehr
- et al.
- 1990
- Physical Review B
A study of the chemical and physical interaction between copper and polyimide
- D.Y. Shih
- J. Paraszczak
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Defect formation in SiO2/Si(100) by metal diffusion and reaction
- M. Liehr
- H. Dallaporta
- et al.
- 1988
- Applied Physics Letters
Stacking-fault-induced defect creation in SiO2 on Si(100)
- M. Liehr
- G.B. Bronner
- et al.
- 1988
- Applied Physics Letters