Heterogeneous integration of III-V materials by direct wafer bonding for high-performance electronics and optoelectronics
- Daniele Caimi
- Preksha Tiwari
- et al.
- 2021
- IEEE T-ED
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Spatially Resolved Diffusion of Aluminum in 4H-SiC during Postimplantation Annealing
- Johanna Muting
- Viktor Bobal
- et al.
- 2020
- IEEE T-ED
Impact of hot-carrier degradation on drain-induced barrier lowering in multifin SOI n-Channel FinFETs with self-heating
- Charu Gupta
- Anshul Gupta
- et al.
- 2020
- IEEE T-ED
Facts and Myths of Dielectric Breakdown Processes-Part II: Post-Breakdown and Variability
- Ernest Y. Wu
- 2019
- IEEE T-ED
Facts and Myths of Dielectric Breakdown Processes-Part I: Statistics, Experimental, and Physical Acceleration Models
- Ernest Y. Wu
- 2019
- IEEE T-ED
Low-Noise Schottky Junction Trigate Silicon Nanowire Field-Effect Transistor for Charge Sensing
- Xi Chen
- Si Chen
- et al.
- 2019
- IEEE T-ED
Reliability Modeling and Analysis of Hot-Carrier Degradation in Multiple-Fin SOI n-Channel FinFETs With Self-Heating
- Anshul Gupta
- Charu Gupta
- et al.
- 2019
- IEEE T-ED
Investigation of Pt-Salt-Doped-Standalone-Multiwall Carbon Nanotubes for On-Chip Interconnect Applications
- Jie Liang
- Rongmei Chen
- et al.
- 2019
- IEEE T-ED
A study on OTS-PCM pillar cell for 3-d stackable memory
- W. Chien
- C. Yeh
- et al.
- 2018
- IEEE T-ED
Modeling of Effective Thermal Resistance in Sub-14-nm Stacked Nanowire and FinFETs
- Ishita Jain
- Anshul Gupta
- et al.
- 2018
- IEEE T-ED