Conference paper
Compression for data archiving and backup revisited
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
The three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections. © 2006.
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
D.D. Awschalom, J.-M. Halbout
Journal of Magnetism and Magnetic Materials
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials