BEOL Cu CMP process evaluation for advanced technology nodes
- Kunaljeet Tanwar
- Donald Canaperi
- et al.
- 2013
- JES
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81 results for Donald Canaperi
Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
- James Kelly
- Charan Surisetty
- et al.
- 2013
- Comptes Rendus Chimie
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- E. Liniger
- T.M. Shaw
- et al.
- 2012
- Microelectronic Engineering
Effects of chemical mechanical polishing on a porous SiCOH dielectric
- S. Gates
- S. Papa Rao
- et al.
- 2012
- Microelectronic Engineering
Thermal stability of copper contact metallization using Ru-containing liner
- Soon-Cheon Seo
- C.-C. Yang
- et al.
- 2011
- Electrochemical and Solid-State Letters
Atom motion of Cu and Co in Cu damascene lines with a CoWP cap
- C.-K. Hu
- L. Gignac
- et al.
- 2004
- Applied Physics Letters
80 nm gate-length Si/Si0.7Ge0.3 n-MODFET with 194 GHz fmax
- S.J. Koester
- K.L. Saenger
- et al.
- 2003
- Electronics Letters
Electron and hole mobility enhancement in strained SOI by wafer bonding
- Lijuan Huang
- Jack O. Chu
- et al.
- 2002
- IEEE Transactions on Electron Devices
SiGe-on-insulator prepared by wafer bonding and layer transfer for high-performance field-effect transistors
- L.J. Huang
- J.O. Chu
- et al.
- 2001
- Applied Physics Letters
Study of field-driven wall-configuration conversions for laminated permalloy in the easy-axis state
- D.A. Herman Jr.
- B.E. Argyle
- et al.
- 1988
- Journal of Applied Physics