Stress and thermal expansion of β-SiC films by the vibrating-membrane method
- B.S. Berry
- W.C. Pritchet
- et al.
- 2011
- Journal of Materials Research
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21 results for I. Babich
Polymer self assembly in semiconductor microelectronics
- C.T. Black
- K.W. Guarini
- et al.
- 2006
- IEDM 2006
Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes
- Steven Steen
- Sharee J. McNab
- et al.
- 2006
- Microelectronic Engineering
Looking into the crystal ball: Future device learning using hybrid E-beam and optical lithography
- S.E. Steen
- S.J. McNab
- et al.
- 2005
- Microlithography 2005
Aggressively scaled (0.143 μm 2) 6T-SRAM cell for the 32 nm node and beyond
- D. Fried
- J. Hergenrother
- et al.
- 2004
- IEDM 2004
High-capacity, self-assembled metal-oxide-semiconductor decoupling capacitors
- Charles T. Black
- Kathryn W. Guarini
- et al.
- 2004
- IEEE Electron Device Letters
Self-Aligned n-Channel Germanium MOSFETs With a Thin Ge Oxynitride Gate Dielectric and Tungsten Gate
- Hulling Shang
- Kam-Leung Lee
- et al.
- 2004
- IEEE Electron Device Letters
Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2003
- Journal of Microlithography, Microfabrication and Microsystems
Fabrication and Mobility Characteristics of Ultra-thin Strained Si Directly on Insulator (SSDOI) MOSFETs
- K. Rim
- K.K. Chan
- et al.
- 2003
- IEDM 2003
Low voltage, scalable nanocrystal FLASH memory fabricated by templated self assembly
- K.W. Guarini
- C.T. Black
- et al.
- 2003
- IEDM 2003