Hot-carrier photoemission in scaled CMOS technologies: A challenge for emission based testing and diagnostics
- Alberto Tosi
- Franco Stellari
- et al.
- 2006
- IRPS 2006
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10 results for Franco Zappa
Innovative packaging technique for backside optical testing of wire-bonded chips
- A. Tosi
- F. Stellari
- et al.
- 2005
- ESREF 2005
Current crowding in faulty MOSFET: Optical and electrical investigation
- A. Tosi
- F. Stellari
- et al.
- 2004
- Microelectronics Reliability
Hot-carrier luminescence: Comparison of different CMOS technologies
- Alberto Tosi
- Franco Stellari
- et al.
- 2003
- ESSDERC 2003
Backside flip-chip testing by means of high-bandwidth luminescence detection
- A. Tosi
- F. Stellari
- et al.
- 2003
- Microelectronics Reliability
CMOS circuit analysis with luminescence measurements and simulations
- F. Stellari
- A. Tosi
- et al.
- 2002
- ESSDERC 2002
Testing CMOS circuits at 50ps resolution with single-photon avalanche detectors
- S. Cova
- C. Porta
- et al.
- 2000
- ESSDERC 2000
A packaging solution for optically testing wire-bonded chips
- Alberto Tosi
- Franco Stellari
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
High-speed CMOS circuit testing by 50 ps time-resolved luminescence measurements
- Franco Stellari
- Franco Zappa
- et al.
- 2001
- IEEE Transactions on Electron Devices
A VLSI-compatible high-speed silicon photodetector for optical data link applications
- Massimo Ghioni
- Franco Zappa
- et al.
- 1996
- IEEE Transactions on Electron Devices