High performance 32nm SOI CMOS with high-k/metal gate and 0.149μm 2 SRAM and ultra low-k back end with eleven levels of copperB. GreeneQ. Lianget al.2009VLSI Technology 2009
Gate length and performance scaling of undoped-body extremely thin SOI MOSFETsAmlan MajumdarXinlin Wanget al.2009IEEE Electron Device Letters
High-performance nMOSFET with in-situ phosphorus-doped embedded Si:C (ISPD eSi:C) source-drain stressorB. YangR. Takalkaret al.2008IEDM 2008
Channel Strain Characterization in Embedded SiGe by Nano-beam DiffractionJ. LiA. Lambertiet al.2008ECS Meeting 2008
High-performance undoped-body 8-nm-thin SOI field-effect transistorsAmlan MajumdarZhibin Renet al.2008IEEE Electron Device Letters
(110) Channel, SiON gate-dielectric PMOS with record high Ion=1 mA/μm through channel stress and source drain external resistance (R ext) engineeringB. YangA. Waiteet al.2007IEDM 2007
Hole transport in nanoscale p-type MOSFET SOI devices with high strainH. NayfehS.-J. Jenget al.2007DRC 2007
High performance transistors featured in an aggressively scaled 45nm bulk CMOS technologyZ. LuoN. Rovedoet al.2007VLSI Technology 2007
Integration of local stress techniques with strained-Si directly on insulator (SSDOI) substratesHaizhou YinZ. Renet al.2006VLSI Technology 2006
Novel enhanced stressor with graded embedded SiGe source/drain for high performance CMOS devicesJ.-P. HanH. Utomoet al.2006IEDM 2006