Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009
Publications
Date
Featured collections
Popular topics
47 results for Leathen Shi
Silicon-on-insulator MOSFETs with hybrid crystal orientations
- M. Yang
- K.K. Chan
- et al.
- 2006
- VLSI Technology 2006
Critical aspects of layer transfer and alignment tolerances for 3D integration processes
- D.C. La Tulipe
- L.T. Shi
- et al.
- 2006
- GBC 2006
High performance FDSOI CMOS technology with metal gate and high-k
- Bruce Doris
- Y.-H. Kim
- et al.
- 2005
- VLSI Technology 2005
Mobility and CMOS devices/circuits on sub-10nm (110) ultra thin body SOI
- Huiling Shang
- J. Rubino
- et al.
- 2005
- VLSI Technology 2005
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
On the integration of CMOS with hybrid crystal orientations
- M. Yang
- V. Chan
- et al.
- 2004
- VLSI Technology 2004
Analysis of an extreme low-κ organosilicate dielectric film exposed to representative plasmas and to a restorative process
- M. Colburn
- S.V. Nitta
- et al.
- 2003
- AMC 2003
New polysilicon disposable sidewall process for sub-50 nm CMOS
- K.L. Lee
- D. Boyd
- et al.
- 2001
- ESSDERC 2001
High performance of planar double gate MOSFETs with thin backgate dielectrics
- E.C. Jones
- M. Ieong
- et al.
- 2001
- DRC 2001