The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
- J.R. Lloyd
- C.E. Murray
- et al.
- 2006
- Microelectronics Reliability
Publications
Date
Featured collections
Popular topics
116 results for Conal Murray
Thermal stress evolution in embedded Cu/low-k dielectric composite features
- Conal E. Murray
- Charles C. Goldsmith
- et al.
- 2006
- Applied Physics Letters
Underlayer effects on texture evolution in copper films
- C.E. Murray
- K.P. Rodbell
- et al.
- 2006
- Thin Solid Films
Solution-processed metal chalcogenide films for p-type transistors
- Delia J. Milliron
- David B. Mitzi
- et al.
- 2006
- Chemistry of Materials
High-resolution strain mapping in heteroepitaxial thin-film features
- C.E. Murray
- H. Yan
- et al.
- 2005
- Journal of Applied Physics
Spatially transient stress effects in thin films by X-ray diffraction
- C.E. Murray
- C.C. Goldsmith
- et al.
- 2005
- Powder Diffraction
Finite size effects in stress analysis of interconnect structures
- I.C. Noyan
- Conal E. Murray
- et al.
- 2004
- Applied Physics Letters
Top-down topography of deeply etched silicon in the scanning electron microscope
- Oliver C. Wells
- Conal E. Murray
- et al.
- 2004
- Review of Scientific Instruments
Strain effects in thin film/Si substrates revealed by X-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2004
- Powder Diffraction
Elastic strain relaxation in free-standing SiGe/Si structures
- P.M. Mooney
- G.M. Cohen
- et al.
- 2004
- Applied Physics Letters