Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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25 results for Veeresh Deshpande

First RF characterization of InGaAs replacement metal gate (RMG) nFETs on SiGe-OI FinFETs fabricated by 3D monolithic integration
- - Veeresh Deshpande
  - V. Djara
  - et al.
- 2016
- EUROSOI-ULIS 2016
Fabrication and characterization of InGaAs-on-insulator lateral N+/n/N+ structures
- - Lukas Czornomaz
  - V. Djara
  - et al.
- 2016
- EUROSOI-ULIS 2016
Confined Epitaxial Lateral Overgrowth (CELO): A novel concept for scalable integration of CMOS-compatible InGaAs-on-insulator MOSFETs on large-area Si substrates
- - Lukas Czornomaz
  - Emanuele Uccelli
  - et al.
- 2015
- VLSI Technology 2015
An InGaAs on Si platform for CMOS with 200 mm InGaAs-OI substrate, gate-first, replacement gate planar and FinFETs down to 120 nm contact pitch
- - V. Djara
  - Veeresh Deshpande
  - et al.
- 2015
- VLSI Technology 2015
Tri-gate In_0.53Ga_0.47As-on-insulator junctionless field effect transistors
- - V. Djara
  - Lukas Czornomaz
  - et al.
- 2015
- EUROSOI-ULIS 2015
Roadmap on ferroelectric hafnia- and zirconia-based materials and devices
- - José P. B. Silva
  - Ruben Alcala
  - et al.
- 2023
- APL Materials
Self-aligned gates for scalable silicon quantum computing
- - Simon Geyer
  - Leon C. Camenzind
  - et al.
- 2021
- Applied Physics Letters
Ambipolar quantum dots in undoped silicon fin field-effect transistors
- - Andreas V. Kuhlmann
  - Veeresh Deshpande
  - et al.
- 2018
- Applied Physics Letters
Impact of Floating Body Effect, Back-Gate Traps, and Trap-Assisted Tunneling on Scaled In_0.53Ga_0.47As Ultrathin-Body MOSFETs and Mitigation Measures
- - Saurabh Sant
  - Paulina Aguirre
  - et al.
- 2018
- IEEE T-ED
Demonstration of 3-D SRAM Cell by 3-D Monolithic Integration of InGaAs n-FinFETs on FDSOI CMOS with Interlayer Contacts
- - Veeresh Deshpande
  - Herwig Hahn
  - et al.
- 2017
- IEEE T-ED