Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2010
- Japanese Journal of Applied Physics
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62 results for S. Purushothaman
Wafer-level 3D integration technology
- Steven J. Koester
- Albert M. Young
- et al.
- 2008
- IBM J. Res. Dev
Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes
- Steven Steen
- Sharee J. McNab
- et al.
- 2006
- Microelectronic Engineering
Patterning pentacene organic thin film transistors
- Ioannis Kymissis
- Christos D. Dimitrakopoulos
- et al.
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
High-performance bottom electrode organic thin-film transistors
- Ioannis Kymissis
- C. Dimitrakopoulos
- et al.
- 2001
- IEEE Transactions on Electron Devices
Opportunities and challenges in ultra low k dielectrics for interconnect applications
- S. Purushothaman
- S.V. Nitta
- et al.
- 2001
- Technical Digest-International Electron Devices Meeting
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Organic transistors with low operating voltage and high mobility
- C. Dimitrakopoulos
- S. Purushothaman
- et al.
- 1999
- DRC 1999
Development of high conductivity lead (Pb)-free conducting adhesives
- Sung K. Kang
- Rajinder S. Rai
- et al.
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A