Study of interfacial reactions between tin and copper by differential scanning calorimetry
- S.K. Kang
- S. Purushothaman
- 1998
- Journal of Electronic Materials
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62 results for S. Purushothaman
Lithographic evaluation of a DUV carbon attenuated phase shift mask
- A.C. Callegan
- K. Babich
- et al.
- 1998
- Microelectronic Engineering
trans-trans-2,5-Bis-[2-{5-(2,2′-bithienyl) }ethenyl] thiophene: Synthesis, characterization, thin film deposition and fabrication of organic field-effect transistors
- Christos D. Dimitrakopoulos
- Ali Afzali-Ardakani
- et al.
- 1997
- Synthetic Metals
Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
- S.K. Kang
- R.S. Rai
- et al.
- 1996
- Journal of Electronic Materials
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Interfacial reactions with lead (Pb)-free solders
- R.S. Rai
- S.K. Kang
- et al.
- 1995
- ECTC 1995
New high conductivity lead (Pb)-free conducting adhesives
- S.K. Kang
- T. Graham
- et al.
- 1995
- IEEE International Symposium on Electronics and the Environment 1995
Thin Film Transfer Process for Low Cost MCM-D Fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Corrosion and Adhesion of Multilayer Pad Structures for Packaging Applications
- Gerald S. Frankel
- Sampath Purushothaman
- et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Thin film transfer process for low cost mcm-d fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1994
- MCMC 1994