F.J. Himpsel, T.A. Jung, et al.
Surface Review and Letters
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
F.J. Himpsel, T.A. Jung, et al.
Surface Review and Letters
R. Ghez, J.S. Lew
Journal of Crystal Growth
Frank R. Libsch, Takatoshi Tsujimura
Active Matrix Liquid Crystal Displays Technology and Applications 1997
A. Krol, C.J. Sher, et al.
Surface Science