Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
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IEDM 1998
Thomas H. Baum, Carl E. Larson, et al.
Journal of Organometallic Chemistry
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008