Low voltage, scalable nanocrystal FLASH memory fabricated by templated self assembly
- K.W. Guarini
- C.T. Black
- et al.
- 2003
- IEDM 2003
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144 results for Lynne Gignac
Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects
- L. Gignac
- C.-K. Hu
- et al.
- 2003
- Microelectronic Engineering
Does line edge roughness matter?: FEOL and BEOL perspectives
- Qinghuang Lin
- Chuck Black
- et al.
- 2003
- Microlithography 2003
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
Effect of liner thickness on electromigration lifetime
- E. Liniger
- C.-K. Hu
- et al.
- 2003
- Journal of Applied Physics
Evaluations and considerations for self-assembled monolayer field-effect transistors
- C.R. Kagan
- A. Afzali
- et al.
- 2002
- Nano Letters
Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
A comparison of grain size measurements in Al-Cu thin films: Imaging verses diffraction techniques
- Lynne Gignac
- C.E. Murray
- et al.
- 2002
- Microscopy and Microanalysis
In situ study of void growth kinetics in electroplated Cu lines
- E. Liniger
- L. Gignac
- et al.
- 2002
- Journal of Applied Physics