A. Reisman, M. Berkenblit, et al.
JES
We introduce a planar, triple-self-aligned double-gate FET structure ("PAGODA"). Device fabrication incorporates wafer bonding, front-end CMP, mixed optical/ebeam lithography, silicided silicon source/drain sidewalls, and back gate undercut and passivation. We demonstrate double-gate FET operation with good transport at both interfaces, inverter action, and NOR logic.
A. Reisman, M. Berkenblit, et al.
JES
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
Biancun Xie, Madhavan Swaminathan, et al.
EMC 2011
M.A. Lutz, R.M. Feenstra, et al.
Surface Science