Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects
- L. Gignac
- C.-K. Hu
- et al.
- 2003
- Microelectronic Engineering
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149 results for C. K. Hu
Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Nanometer precision metrology of submicron Cu/SiO2 interconnects using fluorescence and transmission x-ray microscopy
- Guangyong Xu
- D.E. Eastman
- et al.
- 2003
- Journal of Applied Physics
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
Effect of liner thickness on electromigration lifetime
- E. Liniger
- C.-K. Hu
- et al.
- 2003
- Journal of Applied Physics
Relationship between copper concentration and stress during electromigration in an Al(0.25 at.% Cu) conductor line
- H.K. Kao
- G.S. Cargill III
- et al.
- 2003
- Journal of Applied Physics
Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
In situ study of void growth kinetics in electroplated Cu lines
- E. Liniger
- L. Gignac
- et al.
- 2002
- Journal of Applied Physics
Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
Bimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002