Conference paper
Assembly technology for three dimensional integrated circuits
A. Topol, D.C. La Tulipe, et al.
VMIC 2005
Paper
Sharp reduction of contact resistivities by effective schottky barrier lowering with silicides as diffusion sources
Abstract
An extremely low contact resistivity of 6-7 × 10-9 Ωċcm2 between Ni0.9Pt0.1Si and heavily doped Si is achieved through Schottky barrier engineering by dopant segregation. In this scheme, the implantation of B or As is performed into silicide followed by a low-temperature drive-in anneal. Reduction of effective Schottky barrier height is manifested in the elimination of nonlinearities in IV characteristics. © 2010 IEEE.
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